Description
This is a high-modulus, two-component epoxy paste adhesive formulated for chemical and radiation resistant bonding. It is used to bond precast concrete segments to concrete or steel, and for bonding concrete, masonry, stone, and steel to each other. Additionally, it is suitable for filling spalls, gaps, and cracks where high chemical and/or radiation resistance is needed.
The material consists of Part A (resin) and Part B (hardener) in a 2:1 volume ratio. It can be extended with dried silica sand (1:1 volume ratio) for specific applications requiring reduced heat generation or thicker applications. It can be applied without sag up to 1/4 inch thick.
This epoxy paste is applied in structural bonding of concrete or steel, filling voids, and surface leveling. It can be used on horizontal, vertical, and overhead surfaces. It is particularly suited for environments where chemical and radiation resistance are critical.
· Mix Ratio: 2:1 by volume (resin:hardener)
· Pot Life/Gel Time: 50 minutes for 225 g mix
· Open Time: Approximately 4 hours for a 1/2" bead
· Curing Time: 8000 psi compressive strength in 14 days at 73°F; partial strength developed in 25–48 hours
· Minimum Substrate Temperature for Application: 60°F
· Minimum Substrate Temperature for Cure: 50°F
· Maximum In-Service Temperature: Should not exceed 20°F below Heat Deflection Temperature (HDT), which is 115°F
· Non-Sag Thickness: Up to 1/4 inch
· UV Resistance: Not specified as UV stable or resistant
· Coverage: Approximately 9.4 lbs/gallon mixed; coverage dependent on thickness and substrate
· Do not thin or add solvents to this material.
· Bonds well to dry or damp (not wet) substrates.
· Recommended surface preparation includes cleaning concrete per ASTM D 4259 or ACI 503R, and steel per SSPC SP 5 to "white metal."
· Clean tools with acetone or appropriate detergents before the material cures.
· The product is VOC-free and environmentally safe.
· Extended pot life and working time make it suitable for installations requiring longer handling times.
· Not suitable for continuous immersion in aggressive organic solvents.
Here is the extracted specification summary for CCS Bonder Liquid LWL, formatted for easy inclusion into a materials library or Word document:
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