CCS Grout, Low Modulus

CCS Grout, Low Modulus is a two-component, low viscosity, low modulus epoxy adhesive formulated for pressure injection grouting. It is primarily used for non-structural repairs such as injection grouting of cracks, delaminations, and voids in concrete, masonry, stone, wood, and fiber-reinforced plastic (FRP). It is also suitable for bonding elastomeric or polymer components to rigid substrates and filling porous or honeycombed concrete, especially where stress relief is required.

The system consists of two parts: Part A (clear amber epoxy resin) and Part B (dark purple hardener), which mix in a 2:1 volume ratio to produce a dark purple adhesive. It meets ASTM C 881, Type III, Grade 1 standards.

This material is applied using automatic meter, mix, and dispense equipment, making it ideal for precision injection repairs in concrete structures. It can bond to dry, damp, or wet substrates, including concrete, masonry, and stone. When bonding to polymer substrates like rigid PVC or Neoprene, surfaces must be dry.

·         Installation Temperature: Minimum substrate temperature of 40 °F (4 °C) is required for curing.

·         Pot Life / Gel Time: Approximately 30 minutes for 100 grams at 73 °F (23 °C).

·         Curing Time: Full mechanical properties are achieved after 7 days at 73 °F.

·         Coverage / Thickness: Applications thicker than ¼ inch require pre-placed aggregate to dissipate heat.

·         Surface Preparation: Concrete must be sound and free from bond inhibitors; steel must be cleaned to white metal per SSPC SP 5.

·         Not suitable for bonding in conditions involving sustained shear stress or rigid adhesive requirements.

·         UV resistance is not mentioned; protection from direct sunlight is advisable unless specified otherwise.

·         Material is non-VOC and environmentally safer than solvent-based alternatives.

·         Storage life is at least three years when kept in original sealed containers between 60–90 °F, away from sunlight.