KEMKO 008 SP Liquid Bonder

Bonder - Short Pot Life, Structural Epoxy Adhesive Liquid Bonding Agent

KEMKO 008 SP Liquid Bonder — a two-component, short pot life, structural epoxy adhesive used for high-strength liquid bonding applications. This epoxy bonder is identifiable by its mixed color of blue-gray and is available in 3, 15, and 150-gallon kits.

 KEMKO 008 SP is engineered for structural bonding of plastic (fresh) concrete to hardened concrete and for anchoring materials like bolts, dowels, and rebar into vertical, downward-oriented holes in substrates like concrete, masonry, or stone. It also serves in applications requiring high creep resistance, stress relaxation, and mechanical stability at elevated temperatures. Additional uses include bonding rigid construction materials, repairing delaminated concrete, and anchoring external steel reinforcement or seismic K-Bracing.

 This material consists of two parts: Part A (white liquid epoxy resin) and Part B (black liquid epoxy hardener), mixed at a 2:1 volume ratio (100:35 by weight). It can be modified with other compatible Kemko products: blending with Part B of KEMKO 001 LP Bonder extends working time; blending with Part B of KEMKO 029 SP Bonder increases viscosity. It may be extended with washed and kiln-dried sand aggregates for applications like void filling and patching.

 Ideal for horizontal applications and vertically downward holes. Suitable for use on concrete, masonry, stone, steel, and wood. Its rapid-setting nature allows use in time-critical installations and is compatible with plural component spray rigs. Applications include bonding fresh to hardened concrete, anchoring elements, and structural repairs under variable temperature and moisture conditions.

·      Mixing: 2:1 (A:B) by volume; use low-speed mixing for 2–3 minutes.

·      Surface Preparation: Requires CSP 2–4 per ICRI 310.2R, minimum 250 psi tensile strength (ASTM C1583); steel surfaces to be SSPC-SP 5 / NACE No. 1 cleaned.

·      Installation: Can be applied with trowel, squeegee, roller, or spray. On bonding surfaces, allow 5–10 minutes before mating or pouring fresh concrete. Minimum bond line: 15 mils for fresh-to-hardened concrete; at least 4 mils for other uses.

·      Aggregate Extension: Up to 2 gal sand per 1 gal epoxy for ~500 in³ yield; up to 5 gal sand for ~1,100 in³ epoxy mortar.

·      Pot Life: Very short — approx. 18 minutes at 73°F (23°C).

·      Open Time: ~3 hours at 73°F.

·      Cure Time: 4 days at 73°F; longer at lower temps (10 days at 50°F).

·      Temperature Range: Min. 50°F (10°C) for install/cure; use KEMKO 001 SP for colder conditions (down to 40°F).

·      Heat Resistance: Max in-service temp = 100°F (20°F below HDT of 120°F).

·      UV Resistance: Not UV-stable; intended for interior or covered installations.

·      Thickness Limits: Bond line thickness minimums are 15 mils (fresh to hardened) and 4 mils (general bonding).

·      Coverage: 1 gal yields 231 in³ neat. Coverage varies with aggregate load.

·      Chemical Resistance: Excellent against acids, bases, fuels, oils; limited against hydrocarbon solvents.

·      Color: Standard is blue-gray; custom colors available.