KEMKO 019 LoTempSEAL

Epoxy Adhesive for Crack Sealing or General Bonding

 KEMKO 019 LoTempSEAL is a two-component, solvent-free, non-sag epoxy paste primarily used for surface sealing of cracks and delaminations in rigid construction materials such as concrete, masonry, stone, steel, and sealed wood. It serves both as a preparatory sealing material for pressure injection grouting under the KEMKO Injection Process (KIP System) and as a bonding adhesive for general construction applications, especially in cool and cold environments.

 This product is intended to be used as part of the KIP System for pressure injection grouting. It may be paired with injection resins within this proprietary system (not specified in this TDS). It consists of two parts: Part A (white epoxy resin) and Part B (black epoxy hardener) mixed in a 2:1 volume ratio.

·      Surface sealing for cracks and delaminations before pressure injection.

·      Bonding of rigid substrates in structural repairs.

·      Suitable substrates include dry, damp, and wet (no standing water) concrete, masonry, stone, steel, and sealed wood.

·      Mix Ratio: 2:1 by volume (100:46 by weight).

·      Viscosity (mixed): 7,000 cP.

·      Non-sag Thickness Capability: Up to 1/2 inch.

·      Working Time / Gel Time: 18 minutes at 73°F; 90 minutes at 40°F (100g mass).

·      Cure Time to Bond Strength: 18 hours at 73°F; 4 hours at 40°F.

·      Installation Temperature Range: Minimum substrate temperature for installation and cure is 40°F.

·      Coverage: Approximately 200 - 350 linear feet per gallon in crack cap-sealing applications.

·      UV Stability: Not UV stable; subject to discoloration and chalking under direct sunlight.

·      Chemical Resistance: Excellent resistance to a range of acids, bases, automotive fluids, petroleum fuels, and oils. Limited resistance to hydrocarbon solvents.

·      Color: Mixed material appears concrete gray (blue-gray); custom colors available.

·      Must not be thinned or diluted.

·      Ideal for use in cold conditions due to its low-temperature reactivity.

·      Not suitable for applications with long-term direct UV exposure without topcoat protection.

·      Should be applied by licensed KEMKO applicators using the KIP System.

·      Tools must be cleaned before the material cures using acetone or heavy-duty detergents.

·      Health and safety measures should be strictly observed due to the presence of hazardous amines and potential skin/respiratory reactions.