KEMKO 051 LoMod IR

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Description

Low Modulus Epoxy Adhesive for Pressure Injection Grouting

Material Use:

 KEMKO 051 LoMod IR is a two-component, solvent-free, low-viscosity epoxy adhesive used for non-structural pressure injection grouting. It is primarily applied to fill cracks, delaminations, and voids in rigid construction materials such as concrete, masonry, stone, steel, and sealed wood. It is also suitable for bonding rigid substrates to flexible elastomers and for waterstop applications in construction and control joints.

System Components:

 This product is composed of Part A (epoxy resin) and Part B (epoxy hardener), mixed at a 2:1 volume ratio (100:43 by weight). It is used in conjunction with the KEMKO Injection Process (KIP System), which includes specialized application equipment for metering, mixing, and dispensing. No primers are required, and no additional solvents or thinning agents should be used.

Applications:

 KEMKO 051 is effective for repairing cracks and gaps up to 1/4 inch in width. For larger voids, pre-placed aggregates are recommended. It is particularly useful in both interior and exterior repairs due to its resistance to moisture and chemicals, making it ideal for environments exposed to automotive fluids, deicing agents, and moderate UV exposure.

Application Details:

·      Mix Ratio: 2:1 by volume (A:B)

·      Installation Method: Pressure injection using KIP System equipment

·      Minimum Substrate Temperature: 40°F

·      Viscosity: Mixed viscosity of 275 cP allows deep penetration into fine cracks

·      Pot Life / Gel Time: 30 minutes for 100g mass at 73°F

·      Curing Time: Fully cured after 7 days at 73°F

·      Bonding Capability: Effective on dry, damp, and wet surfaces

·      Thickness Limit: Maximum application without aggregate is 1/4 inch

·      UV Resistance: Does not embrittle over time or under sunlight exposure

·      Coverage: Not explicitly stated in ft²/gal, as it is application-specific for injection

Special Notes:

 KEMKO 051 should not be used in applications involving sustained shear stress, as it is a low modulus adhesive susceptible to creep. It is VOC-free and has a minimum shelf life of three years when stored between 60–90°F in a dry, shaded environment. It is available in 3, 15, and 150-gallon packaging units. The material is available only through licensed KIP System applicators.

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