Description
Fast Set Elastomer for Control Joints and Spall Repair
KEMKO 222 is a two-component, solvent-free epoxy adhesive primarily used for filling wide cracks, gaps, voids, delaminations, and inadequate consolidations in concrete and other substrates. It is ideal for structural repairs requiring high heat deflection temperatures (HDT), and suitable for both dry and underwater applications, including pier and pile encapsulation with fiberglass or steel jackets.
This material consists of Part A (epoxy resin) and Part B (epoxy hardener), mixed in a 2:1 ratio by volume. It may be used with pre-placed aggregate to enhance volume and reduce exothermic reaction during curing.
KEMKO 222 is designed for large void grouting in high-temperature environments. Its typical uses include repair of wide cracks (greater than 1/8"), delaminations, annular spaces, and voids in substrates such as concrete, masonry, steel, stone, and sealed wood. It is also suitable for structural load-bearing repairs conforming to ASTM C881, Type IV standards.
· Surface Prep: Substrates can be dry, damp, or wet but must be sound and free of contaminants. Follow ASTM D4259 and ACI 503R for surface preparation.
· Mixing: Premix each component separately, then combine and mix for 2–3 minutes using a low-speed drill and Jiffy mixer. When using aggregate, continue mixing as required.
· Installation: Must be installed by KEMKO licensee/applicators using the KIP System.
· Pot Life: Approximately 92 minutes at 73°F for a 100 g mix.
· Curing Time:
o 7 days at 73°F: HDT 145°F
o 1 month at 73°F: HDT 155°F
o 8 hours at 150°F: HDT 205°F
· Temperature Limits: Minimum installation temperature is 40°F (substrate).
· Chemical Resistance: Excellent resistance to acids, bases, fuels, oils, and other common industrial chemicals. Limited resistance to hydrocarbon solvents.
· Environmental: VOC-free and suitable for underwater applications.
· Coverage and Thickness: Suitable for applications thicker than 1/8”. Thickness limit or maximum recommended thickness is not specified but should be monitored due to low exothermic nature.
· UV Stability: Not specified; typically epoxy materials like this are not UV stable and may yellow when exposed to sunlight.
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