KEMKO 059 LoMod Paste

Low Modulus, Toughened Epoxy Paste Adhesive

 KEMKO 059 is a two-component, solvent-free, low modulus epoxy paste designed primarily for structural bonding, crack and spall filling, and surface leveling applications. It is especially useful for bonding preformed polymer products like neoprene pads, rubber mats, and PVC sheets to concrete, masonry, stone, and steel surfaces.

 This system includes two parts—Part A (epoxy resin) and Part B (hardener)—mixed in a 2:1 volume ratio (100:43 by weight). The mixed product is a thixotropic paste with non-sag characteristics, even when applied up to 1/4 inch thick.

·      Crack, gap, void, and spall filling in concrete and masonry.

·      Bonding dissimilar materials including elastomeric polymers to rigid construction surfaces.

·      Fairing and leveling surfaces in horizontal, vertical, and overhead orientations.

·      Suitable for both dry and damp substrates.

·      Resistance to thermal cycling and mechanical shock makes it ideal for harsh environments.

·      Mix Ratio: 2:1 by volume (Part A : Part B).

·      Pot Life / Gel Time: Approximately 30 minutes for 200 grams at 73°F.

·      Installation Temperature: Minimum substrate temperature of 40°F.

·      Cure Schedule: Fully cured in 7 days at 73°F.

·      Maximum Application Thickness: 1/4 inch (non-sag).

·      Coverage: Weight per gallon of mixed product is 9.1 lb; coverage depends on application thickness and surface profile.

·      Surface Preparation: Concrete must be sound, free of bond-inhibiting substances, and prepared per ASTM D4259 or ACI 503R guidelines. Steel should be cleaned to white metal (SSPC SP 5).

·      KEMKO 059 is not UV stable and not recommended for applications with continuous UV exposure unless top-coated appropriately.

·      It is not intended for use where sustained shear stress is a concern.

·      The product contains no VOCs, making it suitable for environmentally sensitive applications.

·      Shelf life is at least three years in unopened containers when stored between 60°F and 90°F.

·      Offers excellent chemical resistance to acids, bases, fuels, and other industrial chemicals, though it has limited resistance to hydrocarbon solvents.

·      Available only through KIP System (KEMKO Injection Process) licensed applicators.