KEMKO 068 LO VIS

KEMKO 068 LO VIS IR – Low Viscosity Structural Epoxy Adhesive.  KEMKO 068 is designed for structural repair by pressure injection grouting. It is primarily used for injecting fine cracks (as narrow as 2 mils / 0.05 mm) in concrete, masonry, stone, and wood. This epoxy also serves in applications requiring high load-bearing strength, adhesion in wet or cold conditions, and resistance to creep and stress relaxation.

KEMKO 068 is a two-component epoxy (Part A resin and Part B hardener) used with the proprietary KIP (KEMKO Injection Process) System for automatic meter-mix-dispense application. It is a part of a specialized system available only through certified KEMKO applicators. When used for large voids (>1/4 inch or 6.35 mm), uniform-sized aggregate must be pre-placed to prevent excess heat generation during cure.

·      Structural repair of cracks and delaminations in concrete, masonry, wood

·      Filling of porous or honeycombed concrete and grout

·      Bonding steel plates and CFRP (carbon fiber reinforced polymer) for external reinforcement

·      Anchoring bolts, dowels, and rebar

·      Grouting tight voids under equipment

·      May be used as a Healer/Sealer (KEMKO 186 preferred when time permits)

·      Installation Method: Pressure injection using KIP System

·      Mix Ratio: 2:1 by volume (100:43 by weight)

·      Color: Dark purple mixed (clear amber option available)

·      Viscosity: 200 cps (mixed), increases to 1,150 cps @ 40°F (4°C)

·      Pot Life (Gel Time): 21 minutes at 73°F (23°C), 85 minutes at 40°F (4.4°C)

·      Bond Strength (Wet): 3,600 psi (2 days), 3,700 psi (14 days)

·      Coverage: Not explicitly listed; dependent on crack volume and substrate porosity

·      Mixing: For use with KIP System only

·      Surface Prep: Follows ICRI Guideline 310.2R and SSPC-SP 5 for steel

·      Cure Conditions: Minimum substrate temperature 40°F (4.4°C); not to be thinned or mixed outside of prescribed ratio

·      Full Cure: Not explicitly specified, though compressive strength data is based on 7-day cure at 73°F

·      Chemical Resistance: Excellent to acids, bases, fuels, oils; limited against hydrocarbon solvents

·      UV Resistance: Not UV stable; intended for internal or covered applications

·      Service Temperature Limit: Max service temp should be at least 20°F below HDT (140°F / 60°C)

·      Compatibility: Can bond to dry, damp, wet, and underwater substrates

·      Alternative/Complementary Materials:

o      KEMKO 186 – Preferred for Healer/Sealer applications

o      KEMKO 038 IR – For wider cracks (6 mils to 1/4")

o      KEMKO 322 ULV IR – For low temps or very fine cracks

o      KEMKO 030 HiAmb IR – For temps above 90°F (32.2°C)

o      KEMKO 077 – For large voids

o      KEMKO 050 – For cracks with no rear seal access