KEMKO 171 SP Paste Bonder

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Description

Bonder - Short Pot Life, Structural Epoxy Adhesive Non-Sag Paste

Material Use

KEMKO 171 SP Paste Bonder — a two-component, 1:1 mix ratio structural epoxy adhesive paste with a short pot life and non-sag formulation. It features high-load bearing strength, chemical resistance, and excellent wetting and adhesion properties even on wet (but not water-saturated) substrates.

 This material is designed for structural and non-structural applications including:

·      Structural bonding of precast elements and external reinforcement (e.g., steel plates, K-bracing)

·      Seismic retrofitting and filling of rubble zones or voids in concrete or brick structures

·      Anchoring dowels, bolts, and rebar into concrete, masonry, or stone

·      Surface sealing in crack injection processes using the KIP System (KEMKO Injection Process).

 

System Components

 KEMKO 171 SP functions as a standalone adhesive, but is compatible with aggregate for extension or as part of structural systems. No silica sand is used as filler.

·      Mixing Ratio: 1:1 by volume (100:140 by weight)

·      Color (Mixed): Blue-gray

·      Can be extended with washed and kiln-dried sand (20–60 mesh for pourable, angular for troweling) for filling larger voids.

 

Applications

 Used for:

·      Bonding hardened concrete to hardened concrete

·      Anchoring and doweling

·      Segmental bonding in bridges and parking decks

·      Crack injection (as surface seal)

·      Wet, damp, and dry concrete bonding (no standing water)

·      Horizontal, vertical, and overhead applications

It meets ASTM C881 and AASHTO M235 standards, and is compliant with ACI 548.12 and ACI 548.15-20 specifications.

 

Application Details

·      Installation Temperature: Minimum 40°F (4°C)

·      Pot Life (Gel Time):

o   31 minutes at 50°F

o   21 minutes at 75°F

o   7 minutes at 105°F

·      Heat Deflection Temperature: 129°F (54°C); max in-service temp should be 20°F below this

·      Surface Preparation: ICRI CSP 2 to 4; steel to SSPC-SP5 / NACE No. 1 (white metal)

·      Bond line: Minimum 15 mils for plastic to hardened concrete; 4 mils otherwise

·      Thickness Limit: Non-sag up to 1/4 inch and more without running

·      Coverage: One gallon yields 231 in³ neat; extendable to ~500 in³ with 2 gallons aggregate

·      Anchoring: Detailed epoxy consumption charts for rebar #3–#13 and embedments from 2–12 inches on page 3

·      Shelf Life: 3 years (in sealed containers at 50–90°F).

 

Special Notes

·      Not UV-stable or UV-rated

·      No VOCs; environmentally safer option

·      Do not thin or add solvents

·      Alternative product KEMKO 170 LP is suggested for longer working times

·      Use appropriate PPE during handling due to hazardous amine content in Part B

·      Supports bio-based material use in formulation (eco-friendly)

·      Only available to certified KEMKO applicators.

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